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The Job holder will be responsible for developing, implementing, and overseeing the company's EHSQ strategies, policies, and procedures across all industrial projects in the region. This role requires a deep understanding of international regulations, combined with practical experience in managing complex EHSQ challenges in a dynamic and fast-paced environment
The Field Application Engineer (FAE) will provide technical support and solutions to server clients, ensuring the optimal integration and performance of retimer chips in their high-speed computing interconnects.
This role is for an HES Engineer in the Engineering & Manufacturing department of Industrial / Manufacturing company based in Shanghai. The successful candidate will be responsible for ensuring safety and environmental compliance throughout the organisation.
The AFM Application Manager will lead and oversee the AFM Application Engineer team in China, ensuring the successful deployment, optimization, and support of our semiconductor AFM application for customers.
作为技术总监，您将负责领导技术团队，通过技术创新和工艺改进，确保公司刻蚀设备在行业内保持技术和市场竞争力。
As the Country Manager, you will be the key strategic person for overseeing all aspects of our business operations in China, including but not limited to sales growth, market penetration, business development, customer relationships, and regulatory compliance.
The Analog Design Manager/Director will be responsible for the development of our high-speed analog ICs for optical communication transceivers, ensuring successful commercialization based on previous experience.
The Architect for High-Speed Transceiver Solutions will be responsible for designing, developing, and optimizing transceiver architectures to support optical communication speeds of 200G and above.
you will be responsible for overseeing the entire product lifecycle, from concept to market launch, ensuring that our products meet the standards of performance and reliability.
The R&D Director will play a pivotal role in shaping the future of our semiconductor components, providing a team focused on innovation and excellence.
负责领导和管理硬件研发团队，进行机器人产品的硬件设计和开发工作，确保项目的顺利进行和产品质量的持续提升。
We are seeking an experienced R&D Director to lead the IGBT Module development, with a focus on module packaging design and ideally, familiarity with SiC module design.
As the Head of ASIC Design, you will spearhead the design, development, and refinement of Application-Specific Integrated Circuits (ASICs) tailored for our Hall sensors. This role demands a unique blend of technical proficiency, leadership, and innovation.
We are seeking an exceptional individual to join the team as the Chief Digital Chip Designer.This role is in charge of the design efforts in creating cutting-edge digital chips that will power the next generation of technology.
The SPAD R&D Director will lead and manage the Single-Photon Avalanche Diode design team, driving the development and implementation of SPAD technology in the products.
We are looking for a seasoned professional with a proven track record in driving complex, cross-functional projects that drive efficiency and enhance overall business performance. The ideal candidate will possess advanced Lean Six Sigma expertise, coupled with extensive experience in guiding internal process improvement projects including route to market, tech system and supply chain domains.
My client is looking for a seasoned Head of Advanced Research with a proven track record in AI or sensor technologies to spearhead our innovation journey. The ideal candidate will bring a robust blend of technical expertise, strategic foresight, and operational acumen to drive our R&D initiatives from conceptualization to prototype.
