工程与制造职位 - 工程与制造 - 高阶人才搜寻类别

The Principal, DRAM Design will be responsible for driving the design efforts of DRAM products, ensuring their performance, reliability, and competitiveness in the market.

This role will take responsiblity for site engineering maintenance and reliabilty.
Build up site engineering team from 0 to 1.

作为设备维护工程师，您将在我们的客户团队中扮演关键角色，负责维护和保养ASML光刻机、TL涂布显影机以及扫描电镜等设备，以确保其顺畅运行。

By providing an attractive salary package, an industry leading company in plastic packaging production equipment is looking for an Asian service director with the strong experience in extrusion blow molding equipment or after-sales service in the same industry.

• Responsible for the collaborative system design of DDIC chip, AP, and Panel, and completing the high level architecture design of Micro OLED DDIC;
• 负责DDIC芯片与AP，Panel协同系统设计，完成Micro OLED DDIC顶层架构设计；

We are seeking an exceptional individual to join the team as the Chief Digital Chip Designer.This role is in charge of the design efforts in creating cutting-edge digital chips that will power the next generation of technology.

The SPAD R&D Director will lead and manage the Single-Photon Avalanche Diode design team, driving the development and implementation of SPAD technology in the products.

We are on the lookout for a product manager. You will be responsible for all customer and partner engagement activities for these key market segments. Our mission is to grow demand for our China's current products & services, while defining the creation of the next generation. We do this working closely with sales and FAEs to engage our partners. This role is focusing on the needs of our China's partners developing products for the market.

Main Responsibilities:

• Familiar with the definition of power chips, such as PMU and DC-DC, and work with the team to define high-quality power management architecture and solutions that meet market requirements and have competitive advantages

• 负责电源芯片类的模拟集成电路设计与开发

You would be the representative of the China R&D team to cooperate with the existing team for the development of PIC at component and circuit level.

As the process development director, you would be responsible for driving the process development of ALD equipment for advanced nodes.

As the engineering director, you would play an important role in the development of PVD, etching, ALD, and other wafer processing equipment.

As QLED device expert, you would be in charge of developing QLED device.

As patterning process director, you would be in charge of developing the corresponding process of QLED devices.

You would lead the task force of developing the new advanced packaging process, especially TSV. The job location is flexible, preferred in Shanghai.

美资500强机械加工集团

具有竞争力的职业发展

We are looking for a seasoned professional with a proven track record in driving complex, cross-functional projects that drive efficiency and enhance overall business performance. The ideal candidate will possess advanced Lean Six Sigma expertise, coupled with extensive experience in guiding internal process improvement projects including route to market, tech system and supply chain domains.

As the Technical Manager, you will be responsible for overseeing all technical aspects of our factory operations, including new product and material development, product testing, competitive benchmarking, and the introduction of new technologies. You will provide effective managerial influence to ensure the efficient and effective development of our technical and engineering operations.

The Head of Engineering will be responsible for driving the development and commercialization of our single wafer clean equipment, ensuring product excellence and market competitiveness.

The R&D Director, SiC Module will be responsible for research and development efforts in silicon carbide (SiC) module technology, ensuring the products remain at the cutting edge of performance and reliability.