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Responsible for managing the R&D team of intelligent hardware products, in charge the team to develop and validate customer products from concept to mass production, throughout all stages of engineering design; The functions cover structure, hardware, software, optics, acoustics, radio frequency, antennas, as well as system solutions and system engineering.
The Head of Design Centre will be responsible for overseeing the design team, driving strategic initiatives, and ensuring the timely delivery of high-quality designs.
Driving growth and innovation within Global organizationSolid reputation for high-quality products within the China region
As the Head of Electron Microscopy Lab, you will oversee the operation and utilization of advanced electron microscopy devices, managing a team of scientists and technicians in supporting R&D projects and production processes.
As the CTO, you will lead our R&D team in designing and developing state-of-the-art AI chips that power the next generation of intelligent systems.
Drive the innovation, development, and leadership of analog and mixed-signal research and development activities, ensuring up-to-date designs for consumer and automotive integrated circuits.
Our customers are the NO. 3 global suppliers in the fastener industry. There are 6 factories in the Asia region. In order to further improve the EHS management level of the enterprise and adapt to the relevant requirements of ESG, we are looking for a group EHS Director with rich experience in connector and metal parts manufacturing.
This role of COO - Semiconductor Backend Equipment involves strategic oversight and operational management within the engineering and manufacturing department of a professional services company. The successful candidate will play a key role in driving operational excellence and achieving business objectives.
The Field Application Engineer (FAE) will provide technical support and solutions to server clients, ensuring the optimal integration and performance of retimer chips in their high-speed computing interconnects.
The AFM Application Manager will lead and oversee the AFM Application Engineer team in China, ensuring the successful deployment, optimization, and support of our semiconductor AFM application for customers.
As service manager, you would work as the key contact window with all fab clients in Shanghai and manager the after sales team.
The President of Greater China will oversee all engineering, process, operations, strategy, and business development in the Greater China region, ensuring alignment with global objectives while adapting to local market needs.
As the Country Manager, you will be the key strategic person for overseeing all aspects of our business operations in China, including but not limited to sales growth, market penetration, business development, customer relationships, and regulatory compliance.
We are seeking an experienced R&D Director to lead the IGBT Module development, with a focus on module packaging design and ideally, familiarity with SiC module design.
The Job holder will be responsible for developing, implementing, and overseeing the company's EHSQ strategies, policies, and procedures across all industrial projects in the region. This role requires a deep understanding of international regulations, combined with practical experience in managing complex EHSQ challenges in a dynamic and fast-paced environment
负责领导和管理硬件研发团队,进行机器人产品的硬件设计和开发工作,确保项目的顺利进行和产品质量的持续提升。
you will be responsible for overseeing the entire product lifecycle, from concept to market launch, ensuring that our products meet the standards of performance and reliability.
As Engineering VP, you would be responsible for the overall technical management for the development of motion control for semiconductor equipment. This role is based in mainland China.
The Architect for High-Speed Transceiver Solutions will be responsible for designing, developing, and optimizing transceiver architectures to support optical communication speeds of 200G and above.
The Analog Design Manager/Director will be responsible for the development of our high-speed analog ICs for optical communication transceivers, ensuring successful commercialization based on previous experience.
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